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AM79M576A Metering Subscriber Line Interface Circuit DISTINCTIVE CHARACTERISTICS s Programmable constant-resistance feed s Programmable loop-detect threshold s Ground-key detect s Performs polarity reversal s Ring relay driver s Supports 2.2 Vrms metering (12 and 16 kHz) s Line feed characteristics independent of battery variations s On-chip switching regulator for low-power dissipation s Two-wire impedance set by single external impedance s Tip Open state for ground-start lines s On-hook transmission BLOCK DIAGRAM A(TIP) Ring Relay Driver Ground-Key Detector Input Decoder and Control VCCRING RINGOUT/DGND C1 C2 C3 E0 HPA HPB Two-Wire Interface DET Signal Transmission VTX RSN B(RING) Off-Hook Detector RD Power-Feed Controller RDC om .c 4u et he as at .d w w w DA DB VREG L VBAT BGND Ring-Trip Detector Switching Regulator CHS QBAT CHCLK VCC VEE AGND/DGND Publication# 18412 Rev: D Amendment: /0 Issue Date: October 1999 www..com E1 ORDERING INFORMATION Standard Products AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is formed by a combination of the elements below. AM79M576A J C TEMPERATURE RANGE C = Commercial (0C to 70C)* PACKAGE TYPE J = 32-pin Plastic Leaded Chip Carrier (PL 032) PERFORMANCE GRADE Blank = Standard Specification -1 = Performance Grading -2 = Performance Grading DEVICE NUMBER/DESCRIPTION AM79M576A Metering Subscriber Line Interface Circuit Valid Combinations -1 -2 JC AM79M576A Valid Combinations Valid Combinations list configurations planned to be supported in volume for this device. Consult the local AMD sales office to confirm availability of specific valid combinations, to check on newly released combinations, and to obtain additional data on AMD's standard military grade products. Note: * Functionality of the device from 0C to +70C is guaranteed by production testing. Performance from -40C to +85C is guaranteed by characterization and periodic sampling of production units. 2 AM79M576A Data Sheet CONNECTION DIAGRAM Top View 32-Pin PLCC RINGOUT/DGND B(RING) VCC A(TIP) 31 BGND VREG 4 TP VCCRING L VBAT QBAT CHS CHCLK RSVD E1 5 6 7 8 9 10 11 12 13 14 E0 3 2 1 32 30 29 28 27 26 25 24 23 22 21 TP DA RD HPB HPA VTX VEE RSN AGND 15 DET 16 C2 17 18 C1 C3 19 20 DGND RDC Notes: 1. Pin 1 is marked for orientation. 2. TP is a thermal conduction pin tied to substrate. 3. RSVD = Reserved. Do not connect to this pin. SLIC Products DB 3 PIN DESCRIPTIONS Pin Names AGND A(TIP) BGND B(RING) C3-C1 CHCLK CHS DA DB DET DGND E0 E1 HPA HPB L Type Gnd Output Gnd Output Input Input Input Input Input Output Gnd Input Input Capacitor Capacitor Output Analog (quiet) ground Output of A(TIP) power amplifier Battery (power) ground Output of B(RING) power amplifier Decoder. TTL compatible. C3 is MSB and C1 is LSB. Chopper clock. Input to switching regulator (TTL compatible). Freq = 256 kHz (Nominal). Chopper Stabilization. Connection for external stabilization components. Ring-trip negative. Negative input to ring-trip comparator. Ring-trip positive. Positive input to ring-trip comparator. Detector. When enabled, a logic Low indicates that the selected detector is tripped. Logic inputs C3-C1, E1, and E0 select the detector. Open-collector with a built-in 15 k pull-up resistor. Digital ground A logic High enables DET. A logic Low disables DET. Ground-key enable. E1 = High connects the ground-key detector to DET, and E1 = Low connects the off-hook or ring-trip detector to DET. High-pass filter capacitor. A(TIP) side of high-pass filter capacitor. High-pass filter capacitor. B(RING) side of high-pass filter capacitor. Switching Regulator Power Transistor. Connection point for filter inductor and anode of catch diode. Has up to 60 V of pulse waveform and must be isolated from sensitive circuits. Keep the diode connections short because of the high currents and high di/dt. Quiet Battery. Filtered battery supply for the signal processing circuits. Detector resistor. Threshold modification and filter point for the off-hook detector. DC feed resistor. Connection point for the DC feed current programming network, which also connects to the Receiver Summing Node (RSN). VRDC is negative for normal polarity and positive for reverse polarity. Relay ground for 5 V relays--externally connected to DGND. The metallic current (AC and DC) between A(TIP) and B(RING) is equal to 1000 x the current into this pin. The networks that program receive gain, two-wire impedance, and feed current all connect to this node. Thermal pin. Connection for heat dissipation. Internally connected to substrate (QBAT). Leave as open circuit or connected to QBAT. In both cases, the TP pins can connect to an area of copper on the board to enhance heat dissipation. Battery supply +5 V power supply Ring relay driver (sinks current to RINGOUT). -5 V power supply Regulated Voltage. Provides negative power supply for power amplifiers, connection point for inductor, filter capacitor, and chopper stabilization. Transmit Audio. This output is 0.510 times the A(TIP) and B(RING) metallic voltage.The other end of the two-wire input impedance programming network connects here. Description QBAT RD RDC Battery Resistor Resistor RINGOUT/ DGND RSN Output Input TP Thermal VBAT VCC VCCRING VEE VREG VTX Battery Power Input Power Input Output 4 AM79M576A Data Sheet ABSOLUTE MAXIMUM RATINGS Storage temperature ......................... -55C to +150C Ambient temperature, operating ........... -0C to +70C VCC with respect to AGND ................. -0.4 V to +7.0 V VEE with respect to AGND ................. +0.4 V to -7.0 V VBAT with respect to AGND ................ +0.4 V to -70 V Note: Rise time of VBAT (dv/dt) must be limited to 27 V/s or less when QBAT bypass is 0.33 F. OPERATING RANGES Commercial (C) Devices Ambient temperature ............................. 0C to +70C* VCC ..................................................... 4.75 V to 5.25 V VEE ................................................. -4.75 V to -5.25 V VBAT .................................................. -46.4 V to -54 V VCCRING ................................................. 0 V to 5.25 V AGND/DGND.......................................................... 0 V BGND with respect to AGND.................... -2 V to +2 V Load resistance on VTX to ground .............. 10 k min Operating Ranges define those limits between which device functionality is guaranteed. * Functionality of the device from 0C to +70C is guaranteed by production testing. Performance from -40C to +85C is guaranteed by characterization and periodic sampling of production units. BGND with respect to AGND/DGND.. +1.0 V to -3.0 V A(TIP) or B(RING) to BGND: Continuous ......................................... -70 V to +2 V 10 ms (f = 0.1 Hz) ............................... -70 V to +5 V 1 s (f = 0.1 Hz) ................................ -90 V to +10 V 250 ns (f = 0.1 Hz) .......................... -120 V to +15 V Current from A(TIP) or B(RING)....................... 150 mA Voltage on VCCRING ........................... -0.3 V to +7 V Current through relay drivers or internal driver catch diodes ..............................60 mA Voltage on ring-trip inputs DA and DB .......VBAT to 0 V Current into ring-trip inputs.................................. 10 mA Peak current into regulator switch (L pin) ........150 mA Switcher transient peak off voltage on L pin ......+1.0 V C3-C1, E0, E1, CHCLK to AGND...................................-0.4 V to VCC + 0.4 V Maximum power dissipation (see note) ....... TA = 70C In 32-pin PLCC package..................................1.2 W Note: Thermal limiting circuitry on-chip will shut down the circuit at a junction temperature of about 165C. The device should never be exposed to this temperature. Operation above 145C junction temperature may degrade device reliability. See the SLIC Packaging Considerations for more information. Stresses above those listed under Absolute Maximum Ratings may cause permanent device failure. Functionality at or above these limits is not implied. Exposure to Absolute Maximum Ratings for extended periods may affect device reliability. SLIC Products 5 ELECTRICAL CHARACTERISTICS Description Analog output (VTX) impedance Analog (VTX) output offset 0C to +25C +25C to +85C -40C to 0C 300 Hz to 3.4 kHz ZIN = 600 to 900 -3.1 -5.5 26 26 20 14 48 95 40 35 17 8 3 mA peak ms dB -40 -35 -45 1 Test Conditions (See Note 1) Min Typ 3 Max 20 +40 +35 +45 20 35 +3.1 +5.5 Unit mV Vpk 4 -- 4 4 2 Note Analog (RSN) input impedance Longitudinal impedance at A or B Overload level 4-wire 2-wire Transmission Performance, 2-Wire Impedance 2-wire return loss (See Test Circuit D) 300 Hz to 500 Hz 500 Hz to 2.5 kHz 2.5 kHz to 3.4 kHz OHT 300 Hz to 3.4 kHz 300 Hz to 3.4 kHz 300 Hz to 3.4 kHz 300 Hz to 800 Hz 800 Hz to 3.4 kHz Active state, 50 Hz to 200 Hz OHT state, 50 Hz to 200 Hz dB 4 Longitudinal Balance (2-Wire and 4-Wire, See Test Circuit C); RL = 600 Longitudinal to metallic L-T, L-4 Longitudinal sum (L-T) + (T-L) Longitudinal signal generation 4-L or T-L Longitudinal current capability per wire Dial pulse make or break response time of DET Insertion Loss (See Test Circuits A and B) 2- to 4-wire 4- to 2-wire 4- to 2-wire (In the presence of 2.2 Vrms metering) Metering Signal Insertion Loss (See Test Circuit B) 4- to 2-wire RL = 260, VAB = 2.86 Vrms RTMG = 139.5 k f = 12 kHz or 16 kHz 300 Hz to 3.4 kHz Relative to 1 kHz 0C to +70C -40C to +85C -0.8 -0.2 +0.4 dB 4 VAB = 0 dBm, 1 kHz VRX = 0 dBm, 1 kHz 0C to +70C -40C to +85C 0C to +70C -40C to +85C 5.70 5.65 -0.15 -0.20 5.85 5.85 6.00 6.05 +0.15 +0.20 1.5 dB -- 4 -- 4 4 4 Insertion Loss vs. Frequency (See Test Circuits A and B) 2- to 4-wire or 4- to 2-wire -0.1 -0.15 -0.1 -0.15 -6.00 -6.05 -0.1 -0.15 -0.1 -0.15 3.3 5.3 -5.85 -5.85 +0.1 +0.15 +0.1 +0.15 -5.70 -5.65 +0.1 +0.15 +0.1 +0.15 7.3 s dB dB -- 4 -- 4 -- 4 3, 4 4 -- 4 4 Gain Tracking (See Test Circuits A and B) 2- to 4-wire or 4- to 2-wire Gain accuracy Variation with frequency relative to 1 kHz Gain tracking Group delay +7 dBm to -55 dBm 0C to +70C Reference: 0 dBm -40C to +85C 0 dBm, 1 kHz 300 Hz to 3.4 kHz 0C to +70C -40C to +85C 0C to +70C -40C to +85C dB Balance Return Signal (4- to 4-Wire, See Test Circuit B) +3 dBm to -55 dBm 0C to +70C Reference: -4 dBm -40C to +85C f = 1 kHz 6 AM79M576A Data Sheet ELECTRICAL CHARACTERISTICS (continued) Description 0 dBm +9 dBm Total Harmonic Distortion with metering Idle Channel Noise without Metering Psophometric weighted noise Psophometric idle channel noise with metering Metallic 2-wire 4-wire 2-wire 4-wire 4 kHz to 9 kHz 9 kHz to 1 MHz 256 kHz and harmonics 1 kHz to 15 kHz Above 15 kHz 256 kHz and harmonics Active state Active state RL = 600 RL = 0 OHT state IL = 13.5 mA, RL = 0 RL = 2.25 k RL = 1.96 k RL = 0 RL = 2.25 k RL = 0 -15 14.33 17.5 41 9.35 56 50 15.5 80 mA 47 -7.5 -76 -76 -57 -70 -85 -57 50 53 +7.5 1.0 +15 -75 -80 -46 -52 7 dBmp 4, 7, 12 4, 7, 12 4, 5, 9 4, 5, 9 4, 5 4, 5, 9 4, 5, 9 4, 5 Test Condition (See Note 1) Min Typ -64 -55 Max -50 -40 -35 Unit Note Total Harmonic Distortion (2- to 4-Wire or 4- to 2-Wire) without Metering (See Test Circuits A and B) 300 Hz to 3.4 kHz dB 4, 11 Single Frequency Out-of-Band Noise (See Test Circuit E) Longitudinal dBm Line Characteristics (See Figures 1a, 1b, and 1c) BAT = 48 V, VBAT = -47.3 V, RL = 600 and 900 Apparent battery voltage Loop current accuracy Loop current, Tip Open state Open Circuit state Loop current limit accuracy Loop current--Active state Loop current--Active state Battery = -48.0 V Loop current--OHT Battery = -47.0 V Fault current limit, ILLIM, A and B shorted to GND in OHT state Fault current limit, ILLIM, A and B shorted to GND in Active state Battery Current in Fault Condition OHT state Active state Power Dissipation On hook, Open Circuit state On hook, OHT state On hook, Active state Off hook, OHT state Off hook, Active state (See Figure 2) 40 140 190 350 750 900 80 200 300 500 900 1100 A and B to GND A and B to GND 40 55 mA V % mA % 10 110 RL = 600 RL = 600 RL = 220 mW SLIC Products 7 ELECTRICAL CHARACTERISTICS (continued) Description Supply Currents VCC, on-hook supply current Open Circuit state OHT state Active state Open Circuit state OHT state Active state Open Circuit state OHT state Active state OHT state RL = 0 to 2.2 k 2 5 6 1.0 2.3 2.3 0.4 2.2 3.2 4.0 7.0 9.0 2.0 4.0 4.5 1.0 3.5 5.0 15.5 Test Conditions (See Note 1) Min Typ Max Unit Note VEE, on-hook supply current mA VBAT, on-hook supply current VBAT, off-hook supply current Power Supply Rejection Ration (VRIPPLE = 50 mVrms, Saturation Guard Inactive) VCC VEE VBAT Off-Hook Detector Current threshold IDET = 365/RD B(RING) to GND B(RING) to GND Midpoint to GND -15 +15 % 40 Hz to 3.4 kHz 3.4 kHz to 50 kHz 40 Hz to 3.4 kHz 3.4 kHz to 50 kHz 40 Hz to 3.4 kHz 3.4 kHz to 50 kHz 18 18 20 13 27 20 35 30 30 25 30 30 dB 6, 7 6, 7 6, 7 Ground-Key Off-Hook Detector Thresholds, Active State Resistance threshold Current threshold Ring-Trip Detector Inputs Bias current Offset voltage Source resistance = 0 to 200 k -5 -50 -0.05 0 +50 A mV 2.0 5 9 10.0 k mA 8 Logic Inputs (C3-C1, E0, E1, and CHCLK)x Input High voltage Input Low voltage Input High current Input Low current Logic Output (DET) Output Low voltage Output High voltage Relay Driver On voltage (VCCRING to RINGOUT) Off leakage Zener breakover voltage Zener On voltage 100 A 30 mA 6.0 50 mA to VCCRING, RINGOUT connected to AGND/DGND 0.5 7.2 10.0 11.0 1.25 100 V A V IOUT = 0.8 mA IOUT = -0.1 mA 2.4 0.4 V All inputs except E1 Input E1 -75 -75 -0.4 2.0 0.8 40 45 V A mA * Note: x C3-C1, and E0 have an internal pull up. E1 has an internal pull down. 8 AM79M576A Data Sheet RELAY DRIVER SCHEMATIC VCCRING 7V RINGOUT/DGND QBAT SWITCHING CHARACTERISTICS Symbol Parameter E1 Low to DET High (E0 = 1) tgkde E1 Low to DET Low (E0 = 1) tgkdd tgkd0 E0 High to DET Low (E1 = 0) E0 Low to DET High (E1 = 0) E1 High to DET Low (E0 = 1) tshde E1 High to DET High (E0 = 1) tshdd tshd0 E0 High to DET Low (E1 = 1) E0 Low to DET High (E1 = 1) Switchhoook Detect state RL = 600 , RG open (See Figure G) 0C to +70C -40C to 85C 0C to +70C -40C to 85C 0C to +70C -40C to 85C 3.8 4.0 1.1 1.6 3.8 4.0 Ground-Key Detect state RL open, RG connected (See Figure H) 0C to +70C -40C to 85C 0C to +70C -40C to 85C 0C to +70C -40C to 85C 0C to +70C -40C to 85C 1.1 1.6 1.1 1.6 3.8 4.0 1.2 1.7 Test Conditions Temperature Ranges 0C to +70C -40C to 85C Min Typ Max 3.8 4.0 Unit Note s 4 SLIC Products 9 SWITCHING WAVEFORMS E1 to DET E1 DET tgkde E0 to DET E1 tshde tgkde tshde E0 DET tshdd Note: All delays measured at 1.4 V level. tshd0 tgkdd tgkd0 Notes: * When any power supplies to the MSLIC are removed and the MSLIC is not in the Ringing state, the relay driver must not activate when the relay coil connected to VCCRING is supplied by the same VCC used for powering the MSLIC. If the relay coil connected to VCCRING is supplied by a voltage other than the VCC used for powering the MSLIC, you must: - Provide redundancy of VCC from the supply voltage of the relay - As an alternative, limit the current flowing to all digital inputs to less than 1 mA. 1. Unless otherwise noted, test conditions are BAT = 48 V (voltage at chip VBAT pin = -47.3 V), VCC = +5 V, VEE = -5 V, RL = 600 , CHP = 0.22 F, RDC1 = RDC2 = 18.7 k, CDC = 0.15 F, Rd = 57.6 k, no fuse resistors, two-wire AC output impedance programming impedance (ZT) = 306 k resistive, receive input summing impedance (ZRX) = 300 k resistive. (See Table 2 for component formulas.) Operation in polarity reverse is tested in production. 2. Overload level is defined when THD = 1%. 3. Balance return signal is the signal generated at VTX by VRX. This specification assumes that the two-wire AC load impedance matches the impedance programmed by ZT. 4. Not tested in production. This parameter is guaranteed by characterization or correlation to other tests. 5. These tests are performed with a longitudinal impedance of 90 and metallic impedance of 300 for frequencies < 12 kHz and 135 for frequencies >12 kHz. These tests are extremely sensitive to circuit board layout. Refer to application notes for details. 6. This parameter is tested at 1 kHz in production. Performance at other frequencies is guaranteed by characterization. 7. When the SLIC is in the anti-sat 2 operating region, this parameter will be degraded. The exact degradation will depend on system design. The anti-sat 2 region occurs at high loop resistances when |VBAT| - |VAX - VBX| is less than approximately 13 V. 8. "Midpoint" is defined as the connection point between two 300 series resistors connected between A(TIP) and B(RING). 9. Fundamental and harmonics from 256 kHz switch regulator chopper are not included. 10. Calculate loop current limit, which depends upon the programmed apparent open circuit voltage and the feed resistance, is as follows: 50 * V APPARENT ------------------------------------------In OHT state: ILIMIT = 0.202 and R DC In Active state: ILIMIT = 0.68 10 AM79M576A Data Sheet 11. Total Harmonic distortion with metering is specified with a metering signal of 2.2 Vrms at the two-wire output, and a transmit signal of +3 dBm or receive signal of -4 dBm. The transmit or receive signals are single-frequency inputs, and the distortion is measured as the highest in band harmonic at the two-wire or the four-wire output relative to the input signal. 12. Noise with metering is measured by applying a 2.2 Vrms metering signal (measured at the two-wire output) and measuring the psophometric noise at the two-wire outputs over a 200 ms time interval. Table 1. SLIC Decoding DET Output State 0 1 2 3 4 5 6 7 C3 C2 C1 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 Two-Wire Status Open Circuit Ringing Active On-hook TX (OHT) Tip Open Reserved Active Polarity Reversal OHT Polarity Reversal E0 = 1* E1 = 0 Ring trip Ring trip Loop detector Loop detector Loop detector Loop detector Loop detector Loop detector E0 = 1* E1 = 1 Ring trip Ring trip Ground key Ground key -- -- Ground key Ground key Note: * A logic Low on E0 disables DET output into the Open Collector state. Table 2. Z T = 510 ( Z2WIN - 2R F ) User-Programmable Components ZT is connected between the VTX and RSN pins. The fuse resistors are RF, and Z2WIN is the desired two-wire AC input impedance. When computing ZT, the internal current amplifier pole and any external stray capacitance between VTX and RSN must be taken into account. ZRX is connected from VRX to RSN. ZT is defined above. This equation sets the receive gain to 0 dB when the SLIC terminates with an impedance equal to Z2WIN. RDC1, RDC2, and CDC form the network connected to the RDC pin. RDC1 and RDC2 are approximately equal. Z RX = 0.98 ( Z T ) R DC1 + R DC2 = 50 * ( R FEED - 2R F ) R DC1 + R DC2 C DC = 1.5 ms * --------------------------------RDC1 * R DC2 365 R D = -------- , IT 0.5 ms C D = --------------RD RD and CD form the network connected from RD to -5 V and IT is the threshold current between on-hook and off-hook. ZM is connected from VMG (metering source) to the RSN pin, VM2W is the desired magnitude of the metering signal at the 2-wire output (usually 2.2 Vrms) and K1 ( ) is defined below. 1000 K 1 ( ) = -------------------------------------------------------------------------------------------------------- 9 CX 1 + j 11.5 * 10 + ------- ( 36 + ZL + 2R F ) 2 where: CX = The values of the identical capacitors from A and B to GND = 2 * metering frequency K 1 ( )ZL * Z T VMG Z M = --------------- * -----------------------------------------------------------------------------------V M2W Z T + 0.51 V * K 1 ( ) * ( 2R F + ZL ) SLIC Products 11 DC FEED CHARACTERISTICS 3 4 2 VBAT = 50 V VBAT = 47.3 V 1 5 RDC = 37.5 k Notes: 1. Constant-resistance read region: 2. Anti-sat (battery-tracking) turn-on: 3. Open Circuit voltage: RDC V AB = 49.6 - I L ------------ 49.87 V AB = 0.8975 V BAT - 6.835 V AB = 0.7915 V BAT - 0.113 , V AB = 49.6 V , R DC V AB = 0.7915 V BAT - 0.113 - I L ---------- 815 1724 IL = ----------R DC Active state OHT state V BAT < 62.8 V V BAT 62.8 V 4. Anti-sat (battery-tracking) region: 5. Current limit: a. VA-VB (VAB) Voltage vs. Loop Current (Typical) 12 AM79M576A Data Sheet DC FEED CHARACTERISTICS (continued) VBAT = 47.3 V RDC = 37.5 k b. Loop Current vs. Load Resistance (Typical) A a RL IL SLIC RSN RDC1 b RDC2 B RDC CDC Feed current programmed by RDC1 and RDC2 c. Feed Programming Figure 1. DC Feed Characteristics SLIC Products 13 AM79M576APC - Power @ VBAT = -48 V POWER, Watts 1.5 1 0.5 0 0 1250 2500 Line Resistance (RL), 3750 5000 Figure 2. Active State Total Power Dissipation (Typical) 14 AM79M576A Data Sheet TEST CIRCUITS A(TIP) RL 2 VL RL 2 B(RING) RSN IL2-4 = -20 log (VTX / VAB) VAB AGND RRX RRX B(RING) RSN IL4-2 = -20 log (VAB / VRX) BRS = 20 log (VTX / VRX) A. Two- to Four-Wire Insertion Loss B. Four- to Two-Wire Insertion Loss and Balance Return Signal VRX SLIC VAB RL VTX RT SLIC AGND RT RTMG VRX A(TIP) VTX 1 C S1 ZD << RL RL C VL VL RL 2 B(RING) RSN VRX S2 Open, S1 Closed L-T Long. Bal. = 20 log (VAB / VL) L-4 Long. Bal. = 20 log (VTX / VL) S2 Closed, S1 Open 4-L Long. Sig. Gen. = 20 log (VL / VRX) C. Longitudinal Balance 2 SLIC AGND RT VS S2 RRX R ZIN VM R A(TIP) VTX A(TIP) VTX SLIC AGND RT B(RING) RSN Note: ZD is the desired impedance (e.g., the characteristic impedance of the line). RL = log (2 VM / VS) RRX D. Two-Wire Return Loss Test Circuit SLIC Products 15 TEST CIRCUITS (continued) 68 C A(TIP) RL A(TIP) 56 IDC SLIC SM RL B(RING) RG 68 C B(RING) 1 C << 90 E. Single Frequency Noise SE Current Feed or Ground Key F. Ground-Key Detection VCC 6.2 k A(TIP) A(TIP) DET RL = 600 E0 RG = 3.9 k B(RING) E1 15 pF B(RING) G. Loop-Detector Switching H. Ground-Key Switching 16 AM79M576A Data Sheet PHYSICAL DIMENSION PL032 .447 .453 .485 .495 .009 .015 .125 .140 .080 .095 SEATING PLANE .400 REF. .013 .021 .026 .032 TOP VIEW .050 REF. .490 .530 .042 .056 .585 .595 .547 .553 Pin 1 I.D. SIDE VIEW 16-038FPO-5 PL 032 DA79 6-28-94 ae REVISION SUMMARY Revision A to Revision B * * Minor changes were made to the data sheet style and format to conform to AMD standards. In the Pin Description table, inserted/changed TP pin description to: "Thermal pin. Connection for heat dissipation. Internally connected to substrate (QBAT). Leave as open circuit or connected to QBAT. In both cases, the TP pins can connect to an area of copper on the board to enhance heat dissipation." Revision B to Revision C * Minor changes were made to the data sheet style and format to conform to AMD standards. Revision C to Revision D * * * The physical dimension (PL032) was added to the Physical Dimension section. Deleted the Ceramic DIP and Plastic DIP packages and references to them. Updated the Pin Description table to correct inconsistencies. SLIC Products 17 The contents of this document are provided in connection with Advanced Micro Devices, Inc. ("AMD") products. AMD makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. No license, whether express, implied, arising by estoppel or otherwise, to any intellectual property rights is granted by this publication. Except as set forth in AMD's Standard Terms and Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. AMD's products are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or in any other application in which the failure of AMD's product could create a situation where personal injury, death, or severe property or environmental damage may occur. AMD reserves the right to discontinue or make changes to its products at any time without notice. (c) 1999 Advanced Micro Devices, Inc. All rights reserved. Trademarks AMD, the AMD logo, and combinations thereof are trademarks of Advanced Micro Devices, Inc. Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies. |
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